Dell’Oro Group’s Data Center Liquid Cooling Advanced Research Report provides a five-year forecast and competitive analysis of the global data center liquid cooling market. The research examines market size and outlook by product type, customer segment, and heat-transfer architecture, along with technology trends, vendor strategies, and evolving system designs across rear-door heat exchangers, direct liquid cooling, and immersion cooling.
The research examines how rising semiconductor thermal design power (TDP), rack power densities, and AI workloads are accelerating the transition from air-based thermal management to liquid cooling. It analyzes liquid cooling technologies and architectures, including direct liquid cooling, immersion cooling, and rear-door heat exchangers, as well as cold plates, coolant distribution, customer adoption, and the evolving competitive landscape.
Liquid cooling is becoming increasingly important for supporting high-density data center infrastructure while improving operational efficiency and creating opportunities to reduce water use and enable heat reuse. However, adoption requires significant changes to facility design, IT infrastructure, and operational procedures.
Understanding these changes helps data center operators and infrastructure vendors evaluate the market opportunity, technology choices, system requirements, and competitive positioning as thermal management architectures evolve.
Rear-Door Heat Exchangers (RDHx), Direct Liquid Cooling, and Immersion Cooling
Service Providers and Enterprises
Air Cooling, Air-Assisted Liquid Cooling, and Liquid Cooling
North America, EMEA, China, Asia Pacific excluding China, and CALA
